Back to results
US 6,475,878 B1Granted
Method for singulation of integrated circuit devices
OwnerDusan Slepcevicinventor
Life of this patent
Estimating the term…
Abstract
An improved and more efficient apparatus and method for singulation of integrated circuit array devices. A relatively inexpensive piece of equipment is used for singulation of IC array devices. The equipment has a primary die and a secondary die as main modules. The primary die and the secondary die comprise a top die tool and a bottom die tool having means for protruding, that is generally V-shaped. The protrusions applying pressure for singulation of the IC array devices.
Claims5
A method for singulation of integrated circuit (IC) array devices comprising, in combination, the steps of:
- providing an IC array matrix strip;
- providing a separation device wherein the separation comprises the steps of:
- providing a primary die having a V-shaped top die tool and a V-shaped bottom die tool;
- and
- providing a secondary die having a V-shaped top die tool and a V-shaped bottom die tool;
- applying pressure from both the V-shaped top die tool and a V-shaped bottom die tool of the primary die to separate a column from said IC array matrix strip;
- and
- applying pressure from both the V-shaped top die tool and a V-shaped bottom die tool of the secondary die to said separated column to singulate a device from said column.
5 more elements
Dependencies are inferred from the claim text.