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US 6,475,834 B2Granted
Method of manufacturing a semiconductor component and semiconductor component thereof
AssigneeSemiconductor Components Industries, LLC
InventorsSaat Shukri Embong, Dave Culbertson, Chee Hiong Chew
Life of this patent
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Abstract
A method of manufacturing a semiconductor component includes coupling a clip bond (230) from a semiconductor chip (120) to a lead frame (110) and dividing the clip bond into at least first and second portions separated from each other.
Claims20
A method of manufacturing a semiconductor component comprising:
- coupling a clip bond from a semiconductor chip to a lead frame;
- molding a packaging material around the semiconductor chip, at least a portion of the lead frame, and the clip bond;
- and
- dividing the clip bond into at least first and second portions separated from each other after the step of molding.
1 more element
A method of manufacturing a semiconductor component comprising:
- mounting a semiconductor chip over a lead frame;
- adhering a clip bond to the semiconductor chip and the lead frame after mounting to electrically couple the semiconductor chip to the lead frame;
- encapsulating the semiconductor chip, at least a portion of the lead frame, and at least first and second portions of the clip bond after adhering;
- and
- separating the clip bond into the at least first and second portions after encapsulating.
2 more elements
Dependencies are inferred from the claim text.