Bumpless flip chip assembly with strips and via-fill

A method of making a flip chip assembly, comprising:

• providing a semiconductor chip including a terminal pad;
• providing a substrate including a dielectric layer and an electrically conductive trace, wherein the dielectric layer includes first and second surfaces that are opposite one another and a via hole with sidewalls that extends between the first and second surfaces, and the conductive trace is disposed on the first surface and bent proximate to a corner between the first surface and the via hole and extends into the via hole without contacting a majority of the sidewalls;
• then
• attaching the second surface to the chip wherein the via hole is aligned with the terminal pad;
• then
• depositing an electrically conductive material into the via hole;
• and then
• applying energy to the electrically conductive material thereby transforming the electrically conductive material into a hardened connection joint on the conductive trace and the terminal pad, wherein the connection joint electrically connects the conductive trace and the terminal pad.

A method of making a flip chip assembly, comprising the following steps in the sequence set forth:

• providing a substrate including a dielectric layer and an electrically conductive trace, wherein the dielectric layer includes first and second surfaces that are opposite one another and a via hole that extends between the first and second surfaces, and the conductive trace is disposed on the first surface;
• bending the conductive trace into the via hole;
• positioning the substrate relative to a semiconductor chip, wherein the chip includes a terminal pad, the first surface faces away from the chip, the second surface faces towards the chip and the via hole is aligned with the terminal pad;
• depositing a solder-containing material into the via hole;
• and
• reflowing the solder-containing material to form a solder joint in the via hole and on the conductive trace and the terminal pad, wherein the solder joint electrically connects the conductive trace and the terminal pad.

A method of making a flip chip assembly, comprising the following steps in the sequence set forth:

• providing a substrate, including providing a dielectric layer that includes first and second surfaces that are opposite one another, forming a via hole in the dielectric layer that extends between the first and second surfaces, and forming a conductive trace on the first surface, wherein the conductive trace includes a tip that overlaps the via hole;
• bending the conductive trace proximate to a corner between the first surface and the via hole thereby positioning the tip farther from the first surface and nearer to the second surface;
• attaching the dielectric layer to a semiconductor chip, wherein the chip includes a terminal pad, the first surface faces away from the chip, the second surface faces towards the chip, the via hole is aligned with the terminal pad, and the tip is proximate to the terminal pad;
• depositing a solder-containing material into the via hole;
• and
• reflowing the solder-containing material to form a solder joint that mechanically and electrically connects the conductive trace and the terminal pad.

A method of making a flip chip assembly, comprising the following steps in the sequence set forth:

• providing a substrate including a dielectric layer and an electrically conductive trace, wherein the dielectric layer includes first and second surfaces that are opposite one another and a via hole that extends between the first and second surfaces, and the conductive trace is disposed on the first surface;
• bending the conductive trace into the via hole;
• positioning the substrate relative to a semiconductor chip, wherein the chip includes a terminal pad, the first surface faces away from the chip, the second surface faces towards the chip and the via hole is aligned with the terminal pad;
• depositing a conductive adhesive into the via hole;
• and
• curing the conductive adhesive to form a connection joint in the via hole and on the conductive trace and the terminal pad, wherein the connection joint electrically connects the conductive trace and the terminal pad.

A method of making a flip chip assembly, comprising the following steps in the sequence set forth:

• providing a substrate, including providing a dielectric layer that includes first and second surfaces that are opposite one another, forming a via hole in the dielectric layer that extends between the first and second surfaces, and forming a conductive trace on the first surface, wherein the conductive trace includes a tip that overlaps the via hole;
• bending the conductive trace proximate to a corner between the first surface and the via hole thereby positioning the tip farther from the first surface and nearer to the second surface;
• attaching the dielectric layer to a semiconductor chip, wherein the chip includes a terminal pad, the first surface faces away from the chip, the second surface faces towards the chip, the via hole is aligned with the terminal pad, and the tip is proximate to the terminal pad;
• depositing a conductive adhesive into the via hole;
• and
• curing the conductive adhesive to form a connection joint that mechanically and electrically connects the conductive trace and the terminal pad.