Open-cavity semiconductor die package

A method of manufacturing a semiconductor die package comprising the steps of:

• forming a package assembly including a plurality of electrically conductive leads and a housing defining a cavity for holding at least one semiconductor die, said housing including a plurality of insulative side walls, an internal side wall within said side walls, and an end plate joined to the side walls, each of said plurality of electrically conductive leads extending through at least first and second of said side walls such that an internal lead section extends within the cavity and an external lead section extends externally of said side walls, wherein the internal lead sections of said leads extending through the first side wall are separated from the at least one semiconductor die by said internal side wall;
• and
• forming a cover plate for joining to said side walls opposite said end plate, wherein said cover plate includes an aperture formed therethrough which exposes to the environment the at least one semiconductor die held in the cavity.