Method for making a semiconductor package having improved defect testing and increased production yield

A method of making a packaged semiconductor, comprising:

• means for providing a plurality of unit leadframes in a matrix;
• means for mounting a semiconductor chip having a plurality of bond pads to a die pad in each of said plurality of unit leadframes;
• means for electrically connecting a bond wire between the die pads to the respective said semiconductor chip in each of said plurality of unit leadframes;
• means for encapsulating each of said unit leadframes to form unit semiconductor packages;
• means for singulating each of said unit semiconductor packages from said matrix by singulating dam bars on each of said plurality of unit leadframes between tabs in each of said unit leadframes on two X-axes simultaneously while leaving a connection between tie bars the plurality of unit leadframes and the unit leadframes intact, singulating said dam bars between the tabs in each of said unit leadframes on two Y-axes simultaneously while leaving a connection between the tie bars and the unit leadframes intact;
• and
• means for electrically testing said matrix.

A method of making a packaged semiconductor, comprising:

• providing unit leadframes in a matrix, the unit leadframes each comprising a die pad connected to the unit leadframes by at least one tie bar, a plurality of tabs extending from each of the unit leadframes towards the respective die pad, and a plurality of dam bars provided on a boundary of said tabs;
• mounting a semiconductor chip to a respective die pad in each of said unit leadframes;
• electrically connecting the die pads to the respective semiconductor chip;
• encapsulating the unit leadframes to form unit semiconductor packages;
• singulating each of said unit semiconductor packages from said matrix by singulating the dam bars between the tabs in the unit leadframes on two X-axes simultaneously while leaving a connection between the at least one tie bar and the unit leadframes intact, singulating the dam bars between the tabs in the unit leadframes on two Y-axes simultaneously while leaving a connection between the at least one tie bar and the unit leadframes intact;
• and
• electrically testing said matrix.