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US 6,475,703 B2Granted
Method for constructing multilayer circuit boards having air bridges
AssigneeVisteon Global Technologies, Inc.
InventorsDelin Li, Achyuta Achari, Alice Dawn Zitzmann, Robert Edward Belke, Jr., Brenda Joyce Nation, Edward McLeskey, Mohan R. Paruchuri, Lakhi Nandlal Goenka
Life of this patent
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Abstract
A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.
Claims12
A method for producing a multiplayer circuit board having air bridge crossovers, comprising the steps of:
- (a) providing a metal foil made of a first metal or alloy, wherein the metal foil has top and bottom foil surfaces;
- (b) panel-plating top and bottom fortifying layers made of a second metal onto the top and bottom foil surfaces;
- (c) applying top and bottom plating resist masks to the top and bottom fortifying layers, wherein the top and bottom plating resist masks have respective apertures defined therein corresponding to respective predefined top and bottom conductor patterns;
- (d) pattern plating top and bottom conductor networks made of a third metal onto the top and bottom fortifying layers, through the apertures in the top and bottom plating resist masks;
- (e) stripping the top and bottom plating resist masks, wherein the top and bottom conductor networks mask portions of the top and bottom fortifying layers, and expose, formerly-masked portions of the fortifying layers;
- (f) etching away the formerly-masked portions of the fortifying layers;
- (g) attaching the bottom conductor network to a substrate through an electrically insulative adhesive;
- and
- (h) etching away the metal foil except for those portions thereof sandwiched between the top and bottom conductor networks, thereby forming air bridge crossover structures, wherein the second metal has a higher flex modulus and a higher electrical conductance than that of the third metal.
6 more elements
A method for producing a multilayer circuit board having air bridge crossovers, comprising the steps of:
- (a) providing a metal foil made of a first metal or an alloy wherein the metal foil has top and bottom foil surfaces;
- (b) applying top and bottom plating resist masks to the top and bottom foil surfaces, wherein the top and bottom plating resist masks have respective apertures defined therein corresponding to a predefined top and bottom conductor patterns;
- (c) pattern-plating top and bottom fortifying layers made of a second metal onto the top and bottom foil surfaces, through the apertures in the top and bottom plating resist masks;
- (d) pattern-plating top and bottom conductor networks made of a third metal onto the top and bottom fortifying layers, through the apertures in the top and bottom plating resist masks, wherein the top and bottom conductor networks mask portions of the top and bottom fortifying layers;
- (e) stripping the top and bottom plating resist masks;
- (f) attaching the bottom conductor network to a substrate through an electrically insulative adhesive;
- and
- (g) etching away the metal foil except for those portions thereof sandwiched between the top and bottom conductor networks, thereby forming air bridge crossover structures, wherein the second metal has a higher flex modulus and a higher electrical conductance than that of the third metal.
5 more elements
Dependencies are inferred from the claim text.