Active energy beam curable composition and printed wiring board

An active energy beam curable composition comprising;

• (A) an active energy beam curable vinyl copolymer modified resin to be derived by adding an epoxy compound represented by the following general formula (4) to part of carboxylic group of a copolymer containing at least monomers represented by the following general formulas (1) and (3) among the monomers represented by the following general formulas (1), (2) and (3);
• (B) an active energy beam curable bisphenol type epoxyacrylate resin;
• (C) a reactive diluent;
• (D) a photopolymerization initiator;
• and
• (E) a thermosetting compound.
• wherein R1 represents hydrogen atom or an aliphatic hydrocarbon group having 1 to 6 carbon atoms;
• and:
• R2 represents hydrogen atom, hydroxyl group or alkoxyl group.
• wherein R3 represents hydrogen atom or methyl;
• and R4 represents an aliphatic hydrocarbon group having 1 to 6 carbon atoms or an aromatic group.
• wherein R5 represents hydrogen atom or methyl.
• wherein R6 represents hydrogen atom or methyl;
• R7 represents an alkylene group having 1 to 12 carbon atoms or an aromatic group.