Connecting material and connection structure
AssigneeSony Chemicals Corp.
InventorsJunji Shinozaki, Motohide Takeichi
Life of this patent
Estimating the term…
Abstract
A connecting material that can be used in the mounting of semiconductor devices on a circuit substrate for semiconductor devices, contains the following components A to C: (A) an epoxy resin; (B) a phenol compound having two or more phenolic hydroxyl groups; and (C) a latent curing agent, where it is preferred that if the ratio of the number of phenolic hydroxyl group equivalents of the phenol compound of component B to the number of epoxy equivalents of the epoxy resin in the connecting material is 0.2 to 1.0.
Claims15
A connecting material, comprising the following components A to C:
- (A) an epoxy resin;
- (B) a phenol compound having two or more phenolic hydroxyl groups;
- and
- (C) a latent curing agent,
- wherein the ratio of the number of phenolic hydroxyl group equivalents of the phenol compound of component B to the number of epoxy equivalents of the epoxy resin in the connecting material is 0.2 to 1.0.
A connecting material, comprising the following components A to C:
- (A) an epoxy resin;
- (B) a phenol compound having two or more phenolic hydroxyl groups;
- and
- (C) a latent curing agent,
- wherein the equivalent weight of the phenolic hydroxyl groups in the phenol compound having two or more phenolic hydroxyl groups of component B is 50 to 500 g/eq.
A connecting material, comprising the following components A to C:
- (A) an epoxy resin;
- (B) a phenol compound having two or more phenolic hydroxyl groups;
- and
- (C) a latent curing agent,
- wherein the amount in which the latent curing agent of component C is compounded is 5 to 30 weight parts per 100 weight parts epoxy resin.
A connection structure, comprising a pair of opposing electrodes and a connecting material sandwiched therebetween, these being connected by cold or hot pressing, wherein the connecting material comprising the following components A to C:
- (A) an epoxy resin;
- (B) a phenol compound having two or more phenolic hydroxyl groups;
- and
- (C) a latent curing agent,
- wherein one of the opposing electrodes is a bump electrode for a semiconductor device, and the other is an electrode on a circuit substrate for mounting semiconductor device.
Dependencies are inferred from the claim text.