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AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsMasakazu Mitsuhashi, Yasuaki Mashiko, Hitoshi Kurabe
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A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having a shiny side and a matte side whose average surface roughness (Rz) is in the range of 2.5 to 10 μm to at least one mechanical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 1.5 to 3.0 μm; and subjecting the matte side having undergone the mechanical polishing to a selective chemical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 0.8 to 2.5 μm. The invention further provides an electrodeposited copper foil with its surface prepared, produced by the above process, and still further provides PWBs and a multilayer laminate of PWBs, produced with the use of the above electrodeposited copper foil with its surface prepared. The mechanical polishing followed by chemical polishing of the matte side enables obtaining an electrodeposited copper foil with its surface prepared, the matte side of which exhibits excellent properties, and hence enables obtaining PWBs and a multilayer PWBs which have excellent properties.
A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of:
An electrodeposited copper foil with its surface prepared, having a shiny side and a prepared matte side whose average surface roughness (Rz) is in the range of 0.8 to 2.5 μm, said prepared matte side obtained through the steps of subjecting a matte side of electrodeposited copper foil whose average surface roughness (Rz) is in the range of 2.5 to 10 μm to at least one mechanical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 1.5 to 3.0 μm, and subjecting the matte side having undergone the mechanical polishing to a selective chemical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 0.8 to 2.5 μm.
A printed wiring board comprising an insulating substrate having its surface furnished with a wiring pattern formed from an electrodeposited copper foil with its surface prepared, said electrodeposited copper foil with its surface prepared having a shiny side and a prepared matte side whose average surface roughness (Rz) is in the range of 0.8 to 2.5 μm, said prepared matte side obtained through the steps of subjecting a matte side of electrodeposited copper foil whose average surface roughness (Rz) is in the range of 2.5 to 10 μm to at least one mechanical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 1.5 to 3.0 μm, and subjecting the matte side having undergone the mechanical polishing to a chemical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 0.8 to 2.5 μm.
A multilayer printed wiring board comprising a laminate of a plurality of boards of given thickness, said boards capable of being electrically connected to each other in the direction of the thickness of the laminate, each of said boards having its surface furnished with a wiring pattern formed from an electrodeposited copper foil with its surface prepared, said electrodeposited copper foil with its surface prepared having a shiny side and a prepared matte side whose average surface roughness (Rz) is in the range of 0.8 to 2.5 μm, said prepared matte side obtained through the steps of subjecting a matte side of electrodeposited copper foil whose average surface roughness (Rz) is in the range of 2.5 to 10 μm to at least one mechanical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 1.5 to 3.0 μm, and subjecting the matte side having undergone the mechanical polishing to a chemical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 0.8 to 2.5 μm.
Dependencies are inferred from the claim text.