Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device
AssigneeHitachi Chemical Company, Ltd.
InventorsKazumasa Takeuchi, Tetsuya Saito, Ken Nanaumi
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Abstract
Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.
Claims9
An adhesive sheet comprising a polyimide base layer and an adhesive layer (a) disposed on at least one side of the polyimide base layer, the adhesive layer (a) being a layer of a B-stage cured product of a siloxane-modified polyamideimide resin composition comprising 100 parts by weight of a siloxane-modified polyamideimide resin having a weight average molecular weight of 40,000 to 150,000, and 1 to 200 parts by weight of a thermosetting resin ingredient.
Dependencies are inferred from the claim text.