Method of staining semiconductor wafer samples with a semiconductor treatment chemical

A method of preparing a plurality of semiconductor wafer samples for scanning electron microscopy analysis, comprising:

• removing a first sample from a semiconductor wafer;
• clamping the first sample in a first slot in a first flexible bar;
• removing a second sample from the semiconductor wafer;
• clamping the second sample in a first slot in a second flexible bar and orienting the second sample so that it is substantially coplanar with the first sample;
• placing staining chemicals into an open topped container having an upper rim;
• and
• supporting the first and second flexible bars on the upper rim of the container such that the first and second sample contact the staining chemicals within the container.

A method of preparing a plurality of semiconductor wafer samples for scanning electron microscopy analysis, comprising:

• sectioning a semiconductor wafer into a plurality of samples;
• clamping a first sample in a first slot in a first flexible bar;
• clamping a second sample in a first slot in a second flexible bar and orienting the second sample so that it is substantially coplanar with the first sample;
• placing staining chemicals into an open topped container having an upper rim;
• and
• supporting the first and second flexible bars on the upper rim of the container such that the first and second samples contact the staining chemicals within the container.

A method for staining a plurality of semiconductor wafer samples with a semiconductor treatment chemical, said method comprising:

• gripping a first semiconductor wafer sample in a first openly biasable slot in a first flexible bar;
• gripping a second semiconductor wafer sample in a first openly biasable slot in a second flexible bar;
• gripping a third semiconductor wafer in a first openly biasable slot in a third flexible bar;
• orienting the first, second and third semiconductor wafer samples so that they are substantially coplanar;
• and
• supporting the first, second and third flexible bars such that the semiconductor wafer samples contact the semiconductor treatment chemical.

A method of treating at least a portion of each of a plurality of semiconductor wafers with a staining chemical, said method comprising:

• gripping a first semiconductor wafer that has a size;
• gripping a second semiconductor wafer that has a size that differs from the size of the first semiconductor wafer;
• and
• suspending at least portions of each of the first and second semiconductor wafers into the staining chemical.