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US 6,475,398 B2Granted
Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing same
AssigneeNEC Corporation
InventorHideki Kitahata
Life of this patent
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Abstract
In a semiconductor device having a front surface where circuits are formed and a back surface, a hemishperical solid immersion lens is formed at the back surface of the semiconductor device in a body with the semiconductor device.
Claims8
A method for manufacturing a semiconductor device, comprising the steps of:
- forming a recess in or on a back surface of said semiconductor device;
- fitting a grinding tool having a hemicircularly-cross-sectional groove into said recess;
- and
- rotating said grinding tool so that a hemispherical solid immersion lens is formed at the back surface of said semiconductor device.
1 more element
Dependencies are inferred from the claim text.