Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method

A method of manufacturing an electronic component having a pest repelling layer for repelling pest insects from the surface of a printed wiring board,

• (a) preparing an electronic component material having a pest repellent and a resin which may be crosslinked and cured,
• (b) applying said electronic component material at a specified position on the surface of said printed wiring board,
• (c) forming said cured pest repelling layer, containing said pest repellent, by crosslinking chemical reaction of said resin in said electronic component material on said printed wiring board, said pest repellent having a pyrolysis temperature of greater than about 250° C.,
• wherein said electronic component material is a prepreg containing said resin and said pest repellent impregnated in glass woven fabric or in a glass non-woven fabric,
• said printed wiring board has a glass-epoxy electric insulating board and a copper clad circuit, and
• pressing and heating the glass-epoxy prepreg, said copper clad circuit, and said electronic component material, and laminating and forming said electric insulating board, said copper clad circuit, and said pest repelling layer.

A method of manufacturing an electronic component having a pest repelling layer for repelling pest insects from the surface of a printed wiring board,

• (a) preparing an electronic component material having a pest repellent and a resin which may be crosslinked and cured,
• (b) applying said electronic component material at a specified position on the surface of said printed wiring board,
• (c) forming said cured pest repelling layer, containing said pest repellent, by crosslinking chemical reaction of said resin in said electronic component material on said printed wiring board, said pest repellent having a pyrolysis temperature of greater than about 250° C.,
• wherein said electronic component material is a prepreg containing said resin and said pest repellent impregnated in a glass fabric.

A method of manufacturing an electronic component having a pest repelling layer with a function of repelling pest insects on the surface of a printed wiring board,

• said method comprises the steps of:
• (a) preparing an electronic component material having a pest repellent and a resin,
• said electronic component material having said resin and said pest repellent impregnated into a glass fabric,
• (b) applying said electronic component material at a specified position on the surface of said printed wiring board, and
• (c) laminating said electronic component material and said printed wiring board with heat and pressure.