Anodic bonding of a stack of conductive and glass layers
AssigneeApplied Materials, Inc.
InventorHarald S. Gross
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AssigneeApplied Materials, Inc.
InventorHarald S. Gross
Estimating the term…
We have developed a method of anodic bonding which directs cations to a location within a bonding structure which is away from critical bonding surfaces. This prevents the formation of compounds comprising the cations at the critical bonding surfaces. The anodic bonding electrode contacts are made in a manner which concentrates the cations and compounds thereof in a portion of the bonded structure which can be removed, or cleaned to remove the compounds from the structure. A device formed from the bonded structure contains minimal, if any, of the cation-comprising compounds which weaken bond strength within the structure. In the alternative, the cations and compounds thereof are directed to a portion of the bonding structure which does not affect the function of a device which includes the bonded structure.
A method of anodic bonding at least one layer of conductive material to at least one layer of a second material which is capable of forming an electrochemical cell in combination with said layer of conductive material, said method comprising:
A method of anodic bonding at least one conductive material layer to at least one glass layer to form a bonded structure, wherein said method comprises:
A method of anodic bonding at least one layer of a conductive material to at least one layer of a second material which is capable of forming an electrochemical cell in combination with said layer of conductive material, wherein said method comprises:
Dependencies are inferred from the claim text.