Method and apparatus for separating composite member using fluid
AssigneeCanon Kabushiki Kaisha
InventorsKazuaki Ohmi, Takao Yonehara, Kiyofumi Sakaguchi, Kazutaka Yanagita
Life of this patent
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Abstract
To separate a composite member consisting of a plurality of bonded members without destructing or damaging it, a fluid is jetted against the composite member from a nozzle to separate it into a plurality of members at a position different from a bonding position.
Claims24
A method of separating a composite member having a plurality of members as mutually bonded, at a separation region including microcavities, distortions or defects which is a position different from the bonding position of the plurality of members, comprising jetting a fluid against a side surface of the composite member, the side surface having a recessed or narrow gap, to separate the composite member.
A method of producing a semiconductor substrate comprising the steps of:
- preparing on a substrate a first substrate having a porous single crystal semiconductor layer and a nonporous single crystal semiconductor layer provided on the porous single crystal semiconductor layer;
- bonding the first substrate to a second substrate to form a composite member, the composite member having a recessed or narrow gap on a side surface thereof;
- and
- jetting a fluid to the vicinity of the porous single crystal semiconductor layer of the composite member to separate the composite member at the porous single crystal semiconductor layer.
A method of producing a semiconductor substrate comprising the steps of:
- implanting ions into a first substrate comprising a single crystal semiconductor at a predetermined depth to form an ion-implanted layer such that a microcavity layer can be obtained;
- bonding the first substrate and a second substrate to each other via an insulating layer therebetween to form a composite member, the composite member having a recessed or narrow gap on a side surface thereof;
- and
- jetting a fluid against the vicinity of the ion-implanted layer of the composite member to separate the composite member at the ion-implanted layer.
A method of separating a composite member which is formed by bonding a first substrate comprising a non-porous layer on a porous layer formed by anodization to a second substrate so that the non-porous layer is positioned inside the composite member, comprising applying a pressure by a fluid to a side surface of the composite member, the side surface having a recessed or narrow gap, to separate the composite member at the porous layer.
A method of separating a composite member which is formed by bonding a first substrate comprising a non-porous layer on an ion-implanted layer to a second substrate so that the non-porous layer is positioned inside the composite member, comprising applying a pressure by a fluid to a side surface of the composite member, the side surface having a recessed or narrow gap, to separate the composite member at the ion-implanted layer.
Dependencies are inferred from the claim text.