Adhesive lamination useful in making circuit board structures
AssigneeSharp Kabushiki Kaisha
InventorsShirai Yoshihiro, Tani Shinichi
Life of this patent
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Abstract
An adhesive lamination has patches of an adhesive layer which correspond to predetermined positions on a plurality of circuit boards, and the adhesive layer is applied across the plurality of circuit boards. This adhesive lamination is composed of a first separation sheet, a second separation sheet and the adhesive layer interposed between the first and second separation sheets. A number of patches of the adhesive layer are formed on the first separation sheet and arranged so that the length of the patch of the adhesive layer is approximately parallel to the short side of the first separation sheet.
Claims12
An adhesive lamination for application across a circuit board chain comprising:
- a multiple number of first separation sheets of an approximately rectangular shape;
- a plurality of rectangular shaped patches of an adhesive layer disposed on each of the first separation sheets at evenly spaced intervals such that the long sides of the plurality of patches are approximately parallel with the short sides of the first separation sheets;
- a second separation sheet positioned such that the plurality of rectangular shaped patches are disposed between the plurality of first separation sheets and the second separation sheet;
- the patches being provided in numbers and being arranged at intervals such that, when each of the first separation sheets is applied across a circuit board chain, in which a plurality of circuit boards of an elongated rectangular shape are separably joined along their long sides at said evenly spaced intervals, and the first separation sheets are applied in a direction perpendicular to the long sides of the plurality of circuit boards, the plurality of patches from each of the first separation sheets are distributed with one patch per circuit board in the circuit board chain.
An adhesive lamination comprising:
- a multiple number of first separation sheets of an approximately rectangular shape;
- a plurality of rectangular shaped patches of an adhesive layer disposed on each of the first separation sheets at evenly spaced intervals such that the long sides of the plurality of patches are approximately parallel with the short sides of the first separation sheets;
- a second separation sheet positioned such that the plurality of rectangular shaped patches are disposed between the plurality of first separation sheets-and the second separation sheet;
- whereby application of the first separation sheet across a circuit board chain, comprising a plurality of circuit boards of an elongated rectangular shape separably joined along their long sides at said evenly spaced intervals, distributes the plurality of patches to the plurality of circuit boards,
- and whereby after application of the patches to the circuit boards, the circuit boards in the circuit board chain are separated to form a plurality of individual circuit boards with at least one patch disposed thereon in a position such that when a film with at least one electrode terminal disposed thereon is applied to each individual circuit board, the patch corresponds to the electrode terminal, the plurality of rectangular shaped patches spaced from each other at intervals such that application of the first separation sheet across a circuit board chain distributes one rectangular shaped patch to each circuit board in the circuit board chain.
Dependencies are inferred from the claim text.