Cross flow slurry filtration apparatus and method
AssigneeMicron Technology, Inc.
InventorMichael J. Joslyn
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AssigneeMicron Technology, Inc.
InventorMichael J. Joslyn
Estimating the term…
The present invention is directed toward an apparatus and method for the cross flow filtration of polishing slurry compositions used in semiconductor wafer planarization. In one aspect, an apparatus according to the invention includes an elongated cylindrical filter element adapted to be rotated at predetermined angular velocities that is disposed within a cylindrical housing. The housing has an inlet that is fluidly connected to a source of polishing slurry through a pump, an outlet to provide filtered slurry to a planarization machine, and a bypass outlet that is fluidly connected to the source of polishing slurry to allow refiltration of the bypass fluid. A motor is also included to impart rotational motion to the cylindrical filter element. By rotating the filter element in the housing while slurry is flowing through the housing, a fluid shear layer develops on the filter surface that repels larger particles suspended in the slurry from the filter surface, while admitting those of acceptable size to generate a filtered slurry. A portion of the slurry not subject to filtration is routed to the bypass outlet for refiltration. In an alternate aspect of the invention, the apparatus includes an inner cylindrical filter element and an outer cylindrical filter element that are concentrically disposed within a housing. The filter elements may be independently rotated to achieve multistage filtration of the slurry.
A rotary filtration apparatus for the filtering of an abrasive polishing slurry contained within a storage volume, comprising:
A rotary filtration apparatus for the multistage filtering of an abrasive polishing slurry contained within a storage volume, comprising:
A method for filtering a polishing slurry, comprising:
Dependencies are inferred from the claim text.