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US 6,475,068 B1Granted
Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
AssigneeIbiden Co., Ltd.
InventorsNaoyuki Jimbo, Yuji Okuda, Shigeharu Ishikawa, Atsushi Mishima
Life of this patent
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Abstract
A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
Claims6
A wafer holding plate used in a wafer grinding apparatus, comprising:
- a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive, wherein the wafer adhering surface includes a mirror-like surface in which a groove pattern is formed, wherein the mirror-like surface has a surface roughness Ra of no greater than 0.1 μm.
Dependencies are inferred from the claim text.