Bonding apparatus and bonding method

A bonding method comprising:

• moving a melt ball towards an electrode of a semiconductor integrated circuit until said melt ball reaches a location that corresponds to a position of said melt ball immediately before said melt ball is to contact said electrode, whereby a first inertia is realized;
• and
• after said melt ball reaches said location, moving said melt ball from said location to press and join said melt ball to said electrode, whereby a second inertia is realized,
• wherein the mass associated with said first inertia resulting from moving said melt ball to said location is greater than the mass associated with said second inertia resulting from moving said melt ball from said location.

A bonding method comprising:

• operating a move frame to move a melt ball towards an electrode of a semiconductor integrated circuit until said melt ball reaches a location that corresponds to a position of said melt ball immediately before said melt ball is to contact said electrode;
• and
• after said melt ball reaches said location, operating a moving and pressing device to move said melt ball to press and join said melt ball to said electrode,
• wherein said moving and pressing device is arranged so as to balance with said move frame in terms of inertia.

A bonding apparatus comprising:

• a move frame having a reduced inertial moving and pressing device at one end thereof and a higher speed moving device at another end thereof, said reduced inertial moving and pressing device including a wire guide member at one end thereof and a driving part at another end thereof;
• a frame oscillation shaft for pivotally supporting said move frame;
• a support shaft for pivotally supporting said reduced inertial moving and pressing device relative to said move frame, said support shaft being positioned so as to balance with said frame oscillation shaft in terms of inertia;
• and
• a control device for controlling said higher speed moving device so as to cause said move frame to pivot about an axis of said frame oscillation shaft until a melt ball at a leading end of a wire that projects from said wire guide member reaches a location that corresponds to the position of the melt ball immediately before the melt ball is to contact an electrode of a semiconductor integrated circuit, and for controlling said drive part, after the melt ball reaches the location, so as to cause said reduced inertial moving and pressing device to pivot about an axis of said support shaft such that said wire guide member together with the melt ball moves toward the electrode in order to press and join the melt ball to the electrode.