Soldering method using a Cu-containing lead-free alloy
AssigneeSenju Metal Industry Co., Ltd.
InventorsSeiichiro Hasegawa, Eietsu Hasegawa
Life of this patent
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Abstract
Members to be soldered, such as printed circuit boards having electronic parts mounted thereon, are subjected to flow soldering in a solder bath with a Cu-containing lead-free solder. When the molten solder in the solder bath falls below a prescribed level, the molten solder is replenished with a material having a lower Cu content than the initial composition of the solder bath. Flow soldering can be continued for long periods with the Cu content of the solder bath being maintained substantially constant.
Claims12
A soldering method comprising preparing a solder bath of a Cu-containing lead-free molten solder having a predetermined chemical composition, successively performing flow soldering of a plurality of members in the solder bath, the flow soldering including contacting exposed Cu on the members with the molten solder, and replenishing the solder bath with a lead-free metallic material having a lower Cu content than the predetermined composition.
A soldering method comprising:
- preparing a solder bath of a Cu-containing lead-free molten solder having a predetermined chemical composition;
- successively performing flow soldering in the solder bath of a plurality of printed circuit boards each having electronic parts mounted thereon, the flow soldering including contacting exposed Cu on at least one of the printed circuit boards and the electronic parts with the molten solder;
- monitoring a level of molten solder in the solder bath;
- and supplying a lead-free metallic material having a lower Cu content than the predetermined composition to the solder bath to replenish the solder bath when a level of molten solder in the solder bath falls to a prescribed level.
Dependencies are inferred from the claim text.