Flux composition and corresponding soldering method
OwnerPeter Kukanskisinventor
Life of this patent
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Abstract
A new soldering flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards is disclosed. The new flux composition includes chemical reducing agents such as hydrazine, hydroxylamine, dimethylamine borane, and hydroquinone.
Claims17
A method for mounting an electronic component onto a printed circuit board, which electronic component includes contact points and which printed circuit board includes contact points corresponding to said electronic component contact points, said electronic component contact points bearing regions of solder and said printed circuit board contact points comprising an immersion plated coating comprising a metal selected from the group consisting of silver, tin, bismuth or combinations thereof, said method comprising the steps of:
- a. supplying a printed circuit board with contact points comprising an immersion coating comprising a metal selected from the group consisting of silver, tin, bismuth or combinations thereof;
- b. applying a flux composition to said printed circuit board contact points and/or said electronic component contact points;
- c. positioning said electronic components such that the electronic component contact points touch the corresponding printed circuit board contact points;
- d. applying heat such that at least a portion of the regions of solder melt and flow;
- wherein said flux composition comprises a chemical reducing agent.
A method for mounting an electronic component onto a printed circuit board, which electronic component includes electrically conductive members extending from said component and which printed circuit board includes plated through holes extending from a first surface to a second surface of said printed circuit board, said method comprising the steps of:
- a. supplying a printed circuit board with plated through holes extending from a first surface to a second surface of said printed circuit board and wherein said plated through holes comprise an immersion plated coating comprising a metal selected from the group consisting of silver, tin, bismuth or combinations thereof;
- b. applying a flux composition to said electrically conductive members and/or said plated through holes;
- c. prior to, during or after said flux applying step, positioning said electronic component adjacent to said first surface of said printed circuit board so that said electrically conductive members extend into, or are positioned adjacent to, said plated through holes;
- and
- d. impinging liquid solder into plated through holes such that the solder contacts said electrically conductive members;
- wherein said flux composition comprises a chemical reducing agent.
Dependencies are inferred from the claim text.