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US 6,474,531 B2Granted
Semiconductor light-emitting device and method of manufacturing the same and mounting plate
AssigneeSony Corporation
InventorMasafumi Ozawa
Life of this patent
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AssigneeSony Corporation
InventorMasafumi Ozawa
Estimating the term…
To offer a semiconductor light-emitting device capable of preventing a short circuit failure caused by adhesion of the solder, change of a beam shape, and decrease of a beam output. A semiconductor laser device 1 is manufactured by overlaying a laser tip having a p-side electrode and a n-side electrode in a crystalline substrate and a mounting plate having a first solder film and a second solder film in a supporting body. The laser tip has a level difference A such that the p-side electrode is projected beyond the n-side electrode. The mounting plate has a level difference B such that the first solder film is projected beyond the second solder film. The level difference B of the mounting plate is determined as higher than the level difference A of the laser tip. Therefore, when the mounting plate is overlaid to the laser tip, first, the n-side electrode contacts with the second solder film, and then, the p-side electrode contacts the first solder film. Accordingly, even if the solder is squeezed out in the vicinity of the n-side electrode, the solder is hardly squeezed out in the vicinity of the p-side electrode. The pn junction part is generally positioned in the vicinity of the p-side electrode, which controls the solder to adhesion to the pn junction part.
A method of manufacturing a semiconductor light-emitting device including a semiconductor tip having a first electrode film and a second electrode film on the same side of a base, and a mounting plate having a first solder film and a second solder film in the same side of a supporting body, comprising a step of:
A method of manufacturing a semiconductor light-emitting device including a semiconductor tip having a first electrode film and a second electrode film on the same side of a base, and a mounting plate having a first solder film and a second solder film in the same side of a supporting body, comprising a step of:
A mounting plate utilized by overlaying to a semiconductor tip having a first electrode film and a second electrode film formed in the same side of a base, and having a level difference in a manner that a surface of a first electrode film is projected beyond a surface of a second electrode film therebetween, the mounting plate comprising:
A mounting plate utilized by overlaying to a semiconductor tip having a first electrode film and a second electrode film formed in the same side of a base, and having a level difference in a manner that a surface of a first electrode film is projected beyond a surface of a second electrode film therebetween, the mounting plate comprising:
Dependencies are inferred from the claim text.