Wire bonding apparatus
AssigneeNEC Corporation
InventorsToshiaki Yamaguchi, Noriyuki Kubota
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Abstract
A wire bonding apparatus, which realizes a reduction in weight and inertia of a bonding arm and which allows high-speed Z-axis swinging, is disclosed. The wire bonding apparatus comprises a bonding head 3 fixed to an X-Y stage 30, a bonding arm 4 swinging in the Z-axis direction around a bonding head swinging shaft 13, a pair of wire clamp portions 7a and 7b, and an actuator for driving at least one of wire clamp portions 7a and 7b. At least, one portion of the actuator is provided on the bonding head 3 fixed onto the X-Y stage 30 so as to be spaced apart from the bonding arm 4, whereby a reduction in the weight and inertia of the bonding head 3 is achieved.
Claims13
A wire bonding apparatus comprising an X-Y stage moving in X and Y-directions, a swinging shaft fixed onto said X-Y stage, a bonding arm swinging in the Z-axis direction perpendicular to said X and Y-directions, around said swinging shaft, a pair of wire clamp portions gripping a bonding wire, and an actuator for driving the pair of wire clamp portions,
- wherein at least a section of said actuator and said wire clamp portions is separated from the bonding arm and fixed onto said X-Y stage.
Dependencies are inferred from the claim text.