Particle removing vacuum system for assembly of FBGA packages
AssigneeAdvanced Micro Devices, Inc.
InventorsKasin Jirawat, Watana Sabyeying, Chuawalit Klanruengsang, Khanchit Suphanpesat
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Abstract
The present invention provides a method and system for blowing dust and other foreign particles off semiconductor substrate surfaces. The system may blow ionized air, which neutralizes electrostatic charges on the substrate surface thereby facilitating the release of particles from the substrate and reducing the risk of damage to semiconductor substrates from electrostatic discharge. The system also provides a vacuum for capturing dust particles blown off the surface, thus preventing the particles from contaminating clean room environments and redepositing on the cleaned substrate or other substrates.
Claims15
A cleaning system for cleaning semiconductor substrates, comprising:
- a body;
- a blower outlet mechanically attached to the body;
- and
- a vacuum inlet mechanically attached to the body;
- wherein the shape of the body and the positioning of the blower outlet and vacuum inlet permit the blower outlet and vacuum inlet to be simultaneously placed in proximity to a semiconductor substrate surface to be cleaned whereby air blown from the blower outlet blows dust particles off the semiconductor substrate surface to be cleaned and blown particles are taken up through the vacuum inlet, and the vacuum inlet expands into an inlet manifold and the inlet manifold narrows along its length, whereby particles taken in through the vacuum inlet accelerate as they travel through the manifold, the inlet manifold is integral with the body and the inlet manifold comprises an exit and a series of vanes that channel air flowing in the manifold toward the exit.
A cleaning system for cleaning semiconductor substrates, comprising:
- means for blowing ionized air onto a semiconductor substrate surface, the blowing means attached to a body;
- means for capturing dust particles blown off the semiconductor substrate surface, the capturing means attached to the body;
- and
- wherein the shape of the body and the positioning of the blowing means and capturing means permit the blowing means and capturing means to be simultaneously placed in proximity to a semiconductor substrate surface to be cleaned whereby air blown from the blowing means blows dust particles off the semiconductor substrate surface to be cleaned and blown particles are taken up through the capturing means, and the capturing means expands into an inlet manifold and the inlet manifold narrows along its length, whereby particles taken in through the capturing means accelerate as they travel through the manifold, the inlet manifold is integral with the body and the inlet manifold comprises an exit and a series of vanes that channel air flowing in the manifold toward the exit.
A method of cleaning a semiconductor substrate surface, comprising:
- providing a cleaning system comprising a body;
- a blower outlet mechanically attached to the body;
- and a vacuum inlet mechanically attached to the body;
- wherein the shape of the body and the positioning of the blower outlet and vacuum inlet permit the blower outlet and vacuum inlet to be simultaneously placed in proximity to a semiconductor substrate surface to be cleaned whereby air blown from the blower outlet blows dust particles off the semiconductor substrate surface to be cleaned and blown particles are taken up through the vacuum inlet, and the vacuum inlet expands into an inlet manifold and the inlet manifold narrows along its length, whereby particles taken in through the vacuum inlet accelerate as they travel through the manifold, the inlet manifold is integral with the body and the inlet manifold comprises an exit and a series of vanes that channel air flowing in the manifold toward the exit;
- blowing ionized air onto the semiconductor substrate surface;
- and
- using a vacuum to capture dust particles blown off of the semiconductor substrate surface.
Dependencies are inferred from the claim text.