Adsorption-type cooling apparatus
AssigneeDenso Corporation
InventorsMasaaki Tanaka, Satoshi Inoue, Hideaki Sato, Katsuya Ishii, Hisao Nagashima, Shin Honda, Takahisa Suzuki
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AssigneeDenso Corporation
InventorsMasaaki Tanaka, Satoshi Inoue, Hideaki Sato, Katsuya Ishii, Hisao Nagashima, Shin Honda, Takahisa Suzuki
Estimating the term…
The present invention provides an adsorption-type cooling apparatus comprising first, second, third, and fourth adsorption devices filled with a coolant and contain adsorbents which adsorb evaporated coolant and desorb the adsorbed coolant during heating. Adsorption cores provide heat exchange between the adsorbents and a heat medium, and evaporation and condensation cores provide heat exchange between heating medium and the coolant. A cooling device in which heating medium cooled in the evaporation and condensation cores circulates and cools the object of cooling. A heating means supplies a high-temperature heat medium to the first-fourth adsorption devices. A cooling means supplies a low-temperature heat medium which has a temperature lower than that of the high-temperature heat medium to the first-fourth adsorption devices. Also, a switching control means is provided which switches between multiple states.
An adsorption-type cooling apparatus comprising:
Dependencies are inferred from the claim text.