Apparatus for dense chip packaging using heat pipes and thermoelectric coolers

A method of cooling a heat source, comprising:

• using an evaporator region, having one or more hot point elements, each hot point element having a tapered end, to transfer heat from the heat source to a transport fluid to thereby convert the transport fluid to a vapor;
• using a condenser region associated with a heat sink to transfer the heat from the vapor to the heat sink, wherein the vapor is converted to condensed transport fluid;
• and
• using a fractal-like coupling of the condenser region to the evaporator region.

A method of making an apparatus for cooling a heat source, comprising:

• providing an evaporator region, having one or more hot point elements, each hot point element having a tapered end, for transferring heat from the heat source to a transport fluid, wherein the transport fluid is converted to a vapor when the heat is transferred from the hot point elements to the transport fluid;
• providing a condenser region associated with a heat sink for condensing the vapor to a condensed transport fluid when heat is transferred from the vapor to the heat sink;
• and
• providing a fractal-like coupling of the condenser region to the evaporator region.