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AssigneeCasio Computer Co., Ltd.
InventorsIchiro Kohno, Junji Shiota, Hideki Kamada, Satoshi Kanemitsu, Yoshihiro Kawamura
Estimating the term…
A printer head substrate having a silicon substrate on which heat generating elements and partitions are formed and an orifice plate which adhered to the partitions is placed on a stage of a helicon-wave dry etching system. Helicon-wave dry etching is performed while cooling the printer head substrate by allowing a coolant gas to be intervened between the substrate and the stage. This allows multiple orifices of a desired and adequate shape to be simultaneously and quickly bored in the orifice plate even if a thin film sheet having adhesive layers adhered to both sides thereof is used as the orifice plate, thereby improving the working efficiency.
A method of manufacturing an ink jet printer head having a substrate provided with a plurality of energy generating elements for generating pressure energy for ejecting ink and an orifice plate located on said substrate and having a plurality of ejection nozzles formed therein for ejecting ink in a predetermined direction by pressure generated by said energy generating elements, said method comprising the steps of:
Dependencies are inferred from the claim text.