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US 6,473,963 B1Granted
Method of making electrical circuit board
AssigneeVisteon Global Tech., Inc.
InventorsLakhi N. Goenka, Zhong-You Shi
Life of this patent
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Abstract
A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes is disclosed. The method includes forming channels in a first and second pre-circuit assembly and attaching the first pre-circuit assembly to the second pre-circuit assembly such that the channels cooperatively form a heat pipe.
Claims10
A method for producing a multi-layer circuit board having a heat pipe, said method comprising the steps of;
- providing a first and second pre-circuit assembly respectively having a first and second core metal portion;
- applying protective layers to said first and second pre-circuit assemblies, effective to leave a first exposed portion on said first core metal portion and a second exposed portion on said core metal portion;
- removing said first and second exposed portions to respectively form a first and second channel within said first and second core metal portions;
- and
- attaching said first pre-circuit assembly to said second pre-circuit assembly effective to cause said first and second channels to cooperatively form a heat pipe within said circuit board.
2 more elements
A method for dissipating an amount of heat from a region of a multi-layer circuit board assembly, said method comprising the steps of:
- providing a first and second pre-circuit assembly;
- forming a first channel within said pre-circuit assembly, said first channel being disposed in relative close proximity to said region;
- forming a second channel within said second pre-circuit assembly;
- said second channel being substantially identical in shape to said first channel;
- coupling said first pre-circuit assembly to said second pre-circuit assembly, effective to form said multi-layer circuit board assembly and to cause said first channel to cooperate with said second channel to form a heat pipe;
- and
- inserting an amount of cooling material into said heat pipe, said cooling material being effective to cooperate with said heat pipe to efficiently dissipate said amount of heat from said region.
4 more elements
Dependencies are inferred from the claim text.