Integrated circuit performance and reliability using angle measurement for a patterned bump layout on a power grid
AssigneeSun Microsystems, Inc.
InventorsSudhakar Bobba, Tyler Thorp
Life of this patent
Estimating the term…
Abstract
A method for improving integrated circuit by using a patterned bump layout on a layer of the integrated circuit is provided. The method creates various bump structures by varying an angle between a line from a reference bump to a first bump and a line from the reference bump to a second bump. By varying the angle, a designer may generate a particular bump structure that meets the needs of a particular design. Further, a particular bump placement may be repeated across all or a portion of the metal layer in order to create a patterned bump layout.
Claims20
A method for designing an integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the method comprising:
- defining a desired angle, wherein the desired angle represents an angle formed between a line from a reference bump to a first bump and a line from the reference bump to a second bump, wherein the first and second bumps reside on the first metal bar, and wherein the reference bump resides on the second metal bar;
- and
- using the desired angle to position the first metal bar, the first bump, and the second bump on the integrated circuit.
A method for designing an integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the method comprising:
- defining a desired angle, wherein the desired angle represents an angle formed between a line from a reference bump to a first bump and a line from the reference bump to a second bump, wherein the first and second bumps reside on the first metal bar, and wherein the reference bump resides on the second metal bar;
- and
- using the desired angle to position the first metal bar and the second metal bar on the integrated circuit.
A computer system, comprising:
- a processor;
- a memory;
- and
- instructions, residing in the memory and executable on the processor, for determining a value of an angle between a line from a reference bump to a first bump and a line from the reference bump to a second bump.
A computer-readable medium having instructions therein executable by processing, the instructions for:
- inputting a desired metal layer property;
- and
- determining a value of an angle between a line from a reference bump to a first bump and a line from the reference bump to a second bump based on the desired metal layer property,
- wherein the reference bump resides on a first metal bar, and wherein the first and second bumps reside on a second metal bar.
Dependencies are inferred from the claim text.