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US 6,473,312 B1Granted
Printed circuit board, printed circuit board module and electronic device adapting same
AssigneeFujitsu Limited
InventorsYoshiaki Hiratsuka, Masanori Yamaguchi, Hisashi Yoshinaga
Life of this patent
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Abstract
A printed circuit board includes a ground layer, a power supply layer divided into a plurality of lands, a dielectric layer disposed so as to cover the plurality of lands of the power supply layer, and a conductor layer disposed so as to cover the dielectric layer. The plurality of divided lands are coupled to each other by electrostatic capacitors formed by each of the lands of the power supply layer and the conductor layer sandwiching the dielectric layer therebetween.
Claims14
A printed circuit board comprising:
- a ground layer;
- a power supply layer divided into a plurality of lands;
- a dielectric layer disposed so as to cover the plurality of lands of the power supply layer;
- and
- a conductor layer disposed so as to cover the dielectric layer,
- the plurality of divided lands being coupled to each other by electrostatic capacitors formed by each of the lands of the power supply layer and the conductor layer sandwiching the dielectric layer therebetween.
3 more elements
A printed circuit board module comprising:
- a printed circuit board,
- the printed circuit board comprising:
- a ground layer;
- a power supply layer divided into a plurality of lands;
- a dielectric layer disposed so as to cover the plurality of lands of the power supply layer;
- and
- a conductor layer disposed so as to cover the dielectric layer,
- the plurality of divided lands being coupled to each other by electrostatic capacitors formed by each of the lands of the power supply layer and the conductor layer sandwiching the dielectric layer therebetween.
5 more elements
An electronic device comprising:
- a printed circuit board module,
- the printed circuit board module comprising a printed circuit board,
- the printed circuit board comprising:
- a ground layer;
- a power supply layer divided into a plurality of lands;
- a dielectric layer disposed so as to cover the plurality of lands of the power supply layer;
- and
- a conductor layer disposed so as to cover the dielectric layer,
- the plurality of divided lands being coupled to each other by electrostatic capacitors formed by each of the lands of the power supply layer and the conductor layer sandwiching the dielectric layer therebetween.
6 more elements
Dependencies are inferred from the claim text.