Gate area relief strip for a molded I/C package
AssigneeMicro Technology, Inc.
InventorsStephen L. James, Richard W. Wensel, Brad D. Rumsey
Life of this patent
Estimating the term…
Abstract
A method and device for providing a relief area on the surface of a molded I/C package. Specifically, a method of reducing delamination at the gate area of a molded I/C package by disposing an area of patterned metal traces on the substrate surface to form a relief area. The relief area will permit the I/C package to be broken away form the molding apparatus while reducing the possibility of delamination or Au/Cu burs at the gate area.
Claims39
A system comprising:
- a processor;
- and
- a memory package operatively coupled to the processor, the memory package comprising:
- a memory device;
- a substrate coupled to the memory device, the substrate comprising a relief region, wherein the relief region comprises at least one metal strip disposed on the top surface of the substrate and extending to an edge of an outer perimeter of the memory package, the at least one metal strip having a plurality of apertures therethrough;
- and
- a molding compound disposed on the top surface of the substrate and about a perimeter of the memory device.
An integrated circuit package comprising:
- an integrated circuit device;
- a substrate coupled to the integrated circuit device, the substrate having a relief region, wherein the relief region comprises at least one metal strip disposed on the top surface of the substrate and extending to an edge of an outer perimeter of the integrated circuit package, the at least one metal strip having a plurality of apertures therethrough;
- and
- a molding compound disposed on a top surface of the substrate and about a perimeter of the integrated circuit die.
A method of building an integrated circuit package comprising the acts of:
- (a) providing a substrate;
- (b) disposing at least one metal trace on the top surface of the substrate, the at least one metal trace extending to an edge of an outer perimeter of the integrated circuit package and having a plurality of apertures therethrough;
- (c) disposing an integrated circuit device onto the substrate;
- and
- (d) disposing a molding compound about the integrated circuit device.
A method of building an integrated circuit package comprising the acts of:
- (a) providing a substrate having a relief area on the surface of the substrate, wherein the relief area comprises at least one metal trace on the top surface of the substrate, the at least one metal trace extending to an edge of an outer perimeter of the integrated circuit package and having a plurality of apertures therethrough;
- (b) disposing an integrated circuit device onto the substrate;
- and
- (c) disposing a molding compound about the integrated circuit device.
Dependencies are inferred from the claim text.