US 6,473,310 B1 · Insulated power multichip package

Abstract

The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is directly coupled to at least two chips, without any intervening insulating layers. The slug is physically separated at an appropriate place between the two chips, so that electrical interference between the two chips is effectively eliminated. Making the integrated circuit package begins with directly attaching the two chips to a heat dissipating slug. The heat dissipating slug can have a pre-cut groove running between the chips. Once the chips are attached to the slug, the slug is molded into the multichip integrated circuit package. Then, the slug is physically separated into two pieces from the underside, the separation running along the pre-cut groove. Usually the slug would be separated by being cut by a saw.

Claims17

Dependent claims

An integrated electronic package, comprising:

first and second semiconductor circuit chips;
a conductive slug having a first die pad area directly contacting and coupled to the first semiconductor circuit chip, a second die pad area directly contacting and coupled to the second semiconductor circuit chip, and a recess extending partially through the conductive slug in a region between the first and second die pad areas;
and
a dielectric material positioned in the recess and separating the first and second die pad areas from each other.

1 more element

Dependencies are inferred from the claim text.

Insulated power multichip package

Life of this patent

Insulated power multichip package

Life of this patent

Abstract

Claims17