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AssigneeIntel Corporation
InventorsGlen P. Gordon, Pardeep K. Bhatti
Estimating the term…
A fastening system and a method for retaining temperature control devices used on semiconductor dies transfers the load of the temperature control devices around the semiconductor dies using a spring collet arrangement. An elongated spring collet is installed in a hole in the temperature control device so as to extend outwardly from the temperature control device with the spring collet being movable in the hole relative to the temperature control device in the direction of elongation of the spring collet. An expansion spring resiliently biases the spring collet so as to extend outwardly. An outer end of the spring collet is positioned in a pocket of a retention mechanism of a support member. An electrical connection is made as the temperature control device with semiconductor die is forced down until a pin grid array thereon is properly seated in a socket on the support member. A retention screw is then extended through the spring collet for connection with the retention mechanism and expansion of the spring collet into locking engagement with the temperature control device to retain the temperature control device.
A fastening system for retaining on a support member an assembly of at least one semiconductor die and a temperature control device arranged in heat-conducting relation with said semiconductor die, said fastening system comprising:
A fastening system for retaining on a support member an assembly of at least one semiconductor die and a temperature control device arranged in heatconducting relation with said semiconductor die, said fastening system comprising:
A method for retaining on a supporting member an assembly of at least one semiconductor die and a temperature control device arranged in heat-conducting relation with said semiconductor die, said method comprising:
Dependencies are inferred from the claim text.