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US 6,473,158 B2Granted
Exposure method and exposure apparatus
AssigneeCanon Kabushiki Kaisha
InventorShigeyuki Uzawa
Life of this patent
Estimating the term…
Abstract
An exposure apparatus includes a light source for emitting light, an illumination system for illuminating a pattern of a first object with light from the light source, a projection system for projecting the pattern, as illuminated, onto a second object, wherein the same region on the second object to be exposed is exposed plural times through cooperation of the projection system and the illumination system and a changing device for performing the plural times exposures while changing an exposure condition.
Claims24
An exposure apparatus, comprising:
- a light source for emitting light;
- an illumination system for illuminating a pattern of a first object with light from said light source;
- a projection system for projecting the pattern, as illuminated, onto a second object loaded on a stage, wherein the same region on the second object to be exposed is exposed plural times through cooperation of said projection system and said illumination system;
- and
- changing means for performing the plural times exposures while changing an exposure condition such that the same region on the second object is exposed superposedly in a predetermined exposure time and under different exposure conditions, wherein said changing means changes at least one of a numerical aperture of said projection system and an illumination condition said illumination system, which illumination condition affects the shape of a resist pattern to be formed on a resist upon the second object.
2 more elements
An exposure method, comprising the steps of:
- illuminating a pattern of a first object with light from a light source and via an illumination system;
- and
- projecting the pattern, as illuminated, onto a second object loaded on a stage, wherein the same region on the second object to be exposed is exposed plural times through cooperation of said projecting and illuminating steps, and the plural times exposures are performed while changing an exposure condition such that the same region on the second object is exposed superposedly in a predetermined exposure time and under different exposure conditions, the exposure condition including at least one of a numerical aperture in said projecting step and an illumination condition generated in said illuminating step, which illumination condition affects the shape of a resist pattern to be formed on a resist upon the second object.
An exposure apparatus, comprising:
- an illumination system for illuminating a pattern on a first object, said illumination system having a changeable illumination condition;
- a projection system for projecting the pattern, as illuminated onto a second object loaded on a stage, said projection system having a changeable numerical aperature;
- and
- a control system for controlling said illumination system and said projection system so that the same region on the second object to be exposed is exposed plural times, wherein the control system performs said plural times exposures while changing at least one of a numerical aperture of said projection system and an illumination condition generated by said illumination system such that the same region on the second object is exposed superposedly in a predetermined exposure time and under different exposure conditions, which illumination condition affects the shape of a resist pattern to be formed on a resist upon the second object.
1 more element
An exposure method, comprising:
- a first projection step for projecting a pattern of a first object, as illuminated with light from a light source and via an illumination system, onto a region on a second object loaded on a stage;
- and
- a second projection step for projecting the pattern, as illuminated with light from the light source and via the illumination system, onto the region on the second object, wherein said second projection step is performed under a condition that at least one of a numerical aperture of the projection and an illumination condition generated by the illumination system, which illumination condition affects the shape of a resist pattern to be formed on a resist upon the second object, is made different from that in said first projection step, such that the same region on the second object is exposed superposedly in a predetermined exposure time and under different exposure conditions.
An exposure apparatus, comprising:
- a light source for emitting light;
- an illumination system for illuminating a pattern of a first object with light from said light source;
- a projection system for projecting the pattern, as illuminated, onto a second object, wherein the same region on the second object to be exposed is exposed plural times through cooperation of said projection system and said illumination system;
- and
- changing means for performing the plural-time exposures while changing an exposure condition such that the region on the second object is exposed superposedly under different exposure conditions, wherein said changing means changes at least one of a numerical aperture of said projection system and an illumination condition of said illumination system, which illumination condition is influential to the shape of a resist pattern to be formed upon the second object.
2 more elements
An exposure method, comprising the steps of:
- illuminating a pattern of a first object with light from a light source and via an illumination system;
- and
- projecting the pattern, as illuminated, onto a second object, wherein the same region on the second object to be exposed is exposed plural times through cooperation of said projecting and illuminating steps, and the plural times exposures are performed while changing an exposure condition such that the same region on the second object is exposed superposedly under different exposure conditions, the exposure condition including at least one of a numerical aperture in said projecting step and an illumination condition generated in said illuminating step, which illumination condition is influential to the shape of a resist pattern to be formed upon the second object.
An exposure apparatus, comprising:
- an illumination system for illuminating a pattern on a first object, said illumination system having a changeable illumination condition;
- a projection system for projecting the pattern, as illuminated onto a second object, said projection system having a changeable numerical aperature;
- and
- a control system for controlling said illumination system and said projection system so that the same region on the second object to be exposed is exposed plural times, wherein the control system performs said plural times exposures while changing at least one of a numerical aperture of said projection system and an illumination condition generated by said illumination system such that the same region on the second object is exposed superposedly under different expsure conditions, which illumination condition is influential to the shape of a resist pattern to be formed upon the second object.
1 more element
An exposure method, comprising:
- a first projection step for projecting a pattern of a first object, as illuminated with light from a light source and via an illumination system, onto a region on a second object;
- and
- a second projection step for projecting the pattern, as illuminated with light from the light source and via the illumination system, onto the region on the second object,
- wherein said second projection step is performed under a condition that at least one of a numerical aperture of the projection and an illumination condition generated by the illumination system, which illumination condition is influential to the shape of a resist pattern to be formed upon the second object, is made different from that in said first projection step, such that the same region on the second object is exposed superposedly under different exposure conditions.
1 more element
Dependencies are inferred from the claim text.