Complex circuit board with an electrode and air gap between dielectric and magnetic substrates
AssigneeMurata Manufacturing Co., Ltd.
InventorsYohei Ishikawa, Hiromu Tokudera, Kei Matsutani
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AssigneeMurata Manufacturing Co., Ltd.
InventorsYohei Ishikawa, Hiromu Tokudera, Kei Matsutani
Estimating the term…
In a complex circuit board, the positional relationships between element portions, including an electrode pattern, a dielectric substrate and a magnetic substrate, can be adjusted as desired, and the complex circuit board can be miniaturized. The complex circuit board includes a dielectric substrate and a magnetic substrate, a space being provided between the magnetic substrate and the dielectric substrate, and an electrode pattern provided between the dielectric substrate and the magnetic substrate, a capacitance element portion of the electrode pattern being provided adjacent or in contact with or spaced a predetermined distance from the dielectric substrate, and the inductance element portion of the electrode pattern being provided adjacent or in contact with or spaced a predetermined distance from the magnetic substrate.
A complex circuit board comprising:
A method for manufacturing a complex circuit board comprising the steps of:
A method for manufacturing complex circuit board comprising the steps of:
A complex circuit board comprising:
Dependencies are inferred from the claim text.