Method and system for adapting burn-in boards to multiple burn-in systems

A method for using a first burn-in system, the first burn-in system including a heating chamber and a plurality of burn-in boards for use in the heating chamber, each of the plurality of burn-in boards for holding a plurality of semiconductor devices for testing in the first burn-in system each of the plurality of burn-in boards having a first connector for receiving a plurality of signals for a first portion of the plurality of semiconductor devices, each of the plurality of signals being received in a first corresponding portion of the first connector, the method comprising the steps of:

• (a) plugging an adaptor card into the first burn-in system, the adapter card for use with the first burn-in system and a driver board for a second burn-in system, the driver board being incompatible with the first burn-in system, the driver board having a second connector for outputting the plurality of signals, each of the plurality of signals being provided in a second corresponding portion of the second connector, the adaptor card including a scrambling circuit for providing an interface between the second connector and the first connector such that each of the plurality of signals can be provided from the second corresponding portion of the second connector to the first corresponding portion of the first connector of at least one burn-in board of the plurality of burn-in boards, the adaptor card allowing the driver board to be used in the first burn-in system;
• (b) plugging the driver board into the adapter card;
• and
• (c) performing at least one test on the plurality of semiconductor devices using the driver board and the adapter card;
• wherein the driver board is configured for use with the second burn-in system and is compatible with the second burn-in system, the first burn-in system being incompatible with the second burn-in system.