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US 6,472,891 B1Granted
Method and apparatus for testing semiconductor packages without damage
AssigneeAdvanced Micro Devices, Inc.
InventorDean Tran
Life of this patent
Estimating the term…
Abstract
The accuracy of electrical tests on semiconductor packages is increased and package damage avoided by providing vacuum sensing means to determine proper seating of the package in the testing socket. Embodiments include linking operation of the testing plunger to the vacuum sensor so that the plunger is activated upon proper seating of the semiconductor package in the testing socket.
Claims10
An apparatus for testing a semiconductor package, the apparatus comprising:
- a test plunger;
- a test socket configured to seat a semiconductor package;
- a vacuum sensor having a sensing element configured to detect a semiconductor package position in a test socket;
- and
- a monitoring mechanism configured to determine whether a semiconductor package is properly seated in the test socket.
2 more elements
Dependencies are inferred from the claim text.