Back to results
US 6,472,762 B1Granted
Enhanced laminate flipchip package using a high CTE heatspreader
AssigneeLSI Logic Corporation
InventorZafer S. Kutlu
Life of this patent
Estimating the term…
Abstract
A flipchip packaged integrated circuit comprising a substrate, a die and a heatspreader. The die may be configured to electrically attach to the substrate. The heat spreader may be rigidly attached to the die. The die and the heatspreader may have a combined coefficient of thermal expansion when attached. The heatspreader may be configured to match the combined coefficient of thermal expansion and a coefficient of thermal expansion of the substrate.
Claims20
A flipchip packaged integrated circuit comprising:
- a substrate;
- a die configured to electrically attach to said substrate;
- and
- a heat spreader (i) having a coefficient of thermal expansion (CTE) greater than a CTE of said substrate and (ii) rigidly attached to said die, said die and said heatspreader having a combined CTE when attached, wherein said heatspreader is adjusted to match said combined CTE to said CTE of said substrate.
1 more element
An apparatus comprising:
- a substrate;
- a die configured to electrically attach to said substrate;
- an area array interconnect of solder bumps configured to mechanically and electrically connect said die to said substrate;
- and
- a heat spreader (i) having a coefficient of thermal expansion (CTE) greater than a CTE of said substrate and (ii) rigidly attached to said die, said die and said heatspreader having a combined CTE when attached, wherein said heatspreader is adjusted to match said combined CTE to said CTE of said substrate.
2 more elements
A method for providing mechanical and electrical connection to a die comprising the steps of:
- (A) attaching said die to a substrate;
- and
- (B) rigidly attaching said die to a heat spreader having a coefficient of thermal expansion (CTE) greater than a CTE of said substrate, wherein (i) one or more physical characteristics of said heatspreader are adjusted to provide a combined CTE when attached to said die and (ii) said combined CTE matches said CTE of said substrate.
Dependencies are inferred from the claim text.