Back to results
US 6,472,759 B1Granted
Ball grid array type semiconductor device
AssigneeNEC Corporation
InventorNaoto Kimura
Life of this patent
Estimating the term…
Abstract
A BGA type semiconductor device having a high reliability when mounted on a printed circuit board by preventing cracks and breakage of weld balls of the BGA type semiconductor device. The semiconductor device includes a conductive board having a pair of terminals, a relay terminal and an external terminal, arranged at a distance from each other and on different surfaces of the conductive board. The relay terminal serves as a connection terminal formed on a wiring board. Moreover, a slit 7 is provided around the terminals provided on the conductive board.
Claims7
A semiconductor device comprising:
- a wiring board having on its first surface a conductive wiring and on its second surface a connection terminal connected to the conductive wiring;
- a semiconductor chip mounted on the first surface of the wiring board and electrically connected to the conductive wiring;
- a sealing resin for sealing the semiconductor chip;
- a conductive board having a thickness of 10 to 30 micrometers and;
- having a pair of terminals arranged at a distance and on different surfaces of the conductive board, wherein one of the terminals provided on the conductive board is connected to the connection terminal formed on the wiring board and the other of the terminals provided on the conductive board serves as an external terminal;
- an insulation tape having a thickness of 30 to 50 micrometers, on which a plurality of the conductive boards are arranged;
- and
- an insulation cover having a thickness of 1 to 5 micrometers, for the surface of the conductive board not facing the insulation tape,
- wherein the pair of terminals arranged on the conductive board protude through the insulation tape or the insulation cover.
6 more elements
A semiconductor device comprising:
- a wiring board having on its first surface a conductive wiring and on its second surface a connection terminal connected to the conductive wiring;
- a semiconductor chip mounted on the first surface of the wiring board and electrically connected to the conductive wiring;
- a sealing resin for sealing the semiconductor chip;
- a conductive board having a thickness of 10 to 30 micrometers and;
- having a pair of terminals arranged at a distance and on different surfaces of the conductive board, wherein one of the terminals provided on the conductive board is connected to the connection terminal formed on the wiring board and the other of the terminals provided on the conductive board serves as an external terminal;
- an insulation tape having a thickness of 30 to 50 micrometers, on which a plurality of the conductive boards are arranged;
- and
- an insulation cover having a thickness of 1 to 5 micrometers, for the surface of the conductive board not facing the insulation tape,
- wherein the pair of terminals arranged on the conductive board protude through the insulation tape or the insulation cover and
- wherein a slit is provided through the insulation tape and the conductive board around the terminals arranged on the conductive board.
7 more elements
A semiconductor device comprising:
- a wiring board having on its first surface a conductive wiring and on its second surface a connection terminal connected to the conductive wiring;
- a semiconductor chip mounted on the first surface;
- and
- a conductive board having a thickness of 1 to 5 micrometers and, having a first terminal directly connected to a first side of the conductive board and a second terminal directly connected to an opposite second side of the conductive board, said first terminal being connected to the connection terminal and said second terminal being an external terminal;
- an insulation tape having a thickness of 30 to 50 micrometers, on which a plurality of the conductive boards are arranged;
- and
- an insulation cover having a thickness of 1 to 5 micrometers, for the surface of the conductive board not facing the insulation tape.
4 more elements
Dependencies are inferred from the claim text.