System and method for providing MMIC seal

A method for protecting circuit construction elements from degradation, comprising the steps of:

• depositing a circuit construction element on a host circuit component portion;
• interfacing a circuit component with said deposited circuit construction element, wherein said step of interfacing results in an exposed portion of said circuit construction element remaining after interfacing, and said step of interfacing facilitates a change in operating characteristics of said circuit component due to degradation of said circuit construction element;
• and
• depositing an amount of protective element in a void provided in a corresponding relationship with said exposed portion of said circuit construction element to provide coverage of said exposed portion of said circuit construction element while minimizing contact of said protective element with said circuit component to thereby prevent changes in said operating characteristics of said circuit component due to said degradation of said circuit construction element.

A system for maintaining a circuit impedance of a microwave integrated circuit, said system comprising:

• a microwave integrated circuit disposed in a host circuit;
• a bonding agent disposed between at least a portion of said microwave integrated circuit and at least a portion of said host circuit to retain said microwave integrated circuit and said host circuit in proximity to each other, wherein said bonding agent has at least one exposed portion associated therewith;
• a channel disposed to include said exposed portion of said bonding agent therein;
• and
• a predetermined amount of resin disposed in said channel to cover said exposed portion of said bonding agent without covering said microwave integrated circuit.

A method for maintaining the effective operating characteristics of a microwave integrated circuit, said method comprising the steps of:

• providing a circuit base having a first portion for supporting a first circuit component and a second portion for supporting said microwave integrated circuit, wherein said first support portion and said second support portion are at least in part separated by a channel;
• depositing a bonding agent on said second support portion;
• interfacing said microwave integrated circuit with said deposited bonding agent, wherein said step of interfacing results in an exposed portion of said circuit construction element remaining after interfacing;
• and
• depositing a predetermined amount of resin in said channel, wherein a viscosity of said resin is selected to provide migration of said deposited amount of resin to cover said exposed portion of said bonding agent thereby maintaining said effective operating characteristics of said microwave integrated circuit.