Mixed analog and digital integrated circuits

An IC package including an encapsulated integrated circuit, the IC having a fist die in stacked configuration relative to a second die with the first and second dies comprised of predominantly digital circuits and analog circuits, respectively,

• the first and second dies including bonding pads coupled by die-to-die digital bond wires electrically connecting associated digital circuits thereof,
• the die-to-die digital bond wires providing routing channels arranged in a manner to optimize the length and position of the associated routing channel.

An IC having a package substrate and a first die in stacked configuration relative to a second die with the first and second dies comprised of predominantly digital circuits and analog circuits, respectively,

• the package substrate and the second die including bonding pads coupled by analog bond wires electrically connecting associated analog circuits thereof,
• the analog bond wires being arranged and located in a manner to minimize interference caused by any digital die-to-die bond wires connecting digital circuits.

An IC package including an encapsulated integrated circuit, the IC having a package substrate and a first die in stacked configuration relative to a second die with the first and second dies comprised of predominantly digital circuits and analog circuits, respectively,

• the package substrate and the second die including bonding pads coupled by analog bond wires electrically connecting associated analog circuits thereof,
• the analog bond wires being arranged and located in a manner to minimize interference caused by any digital die-to-die bond wires connecting digital circuits.

An IC having a first die in stacked configuration relative to a second die with the first and second dies comprised of predominantly digital circuits and analog circuits, respectively,

• the first and second dies having bonding pads providing electrical connection therebetween by associated die-to-die bond wires,
• at least one of said die-se bond wires operating as a digital serial interface providing commands from a digital circuit on the first die to a digital control circuit on the second die, the digital control circuit using the commands to control circuits on the second die.

An IC package including an encapsulated integrated circuit, the IC having a first die in stacked configuration relative to a second die with the first and second dies comprised of predominantly digital circuits and analog circuits, respectively,

• the first and second dies having bonding pads providing electrical connection therebetween by associated die-to-die bond wires,
• at least one of said die-to-die bond wires operating as a digital serial interface providing commands from a digital circuit on the first die to a digital control circuit on the second die, the digital control circuit using the commands to control circuits on the second die.

An IC having a first die in stacked configuration relative to a second die with the first and second dies comprised of predominantly digital circuits and analog circuits, respectively,

• the first and second dies having bonding pads providing electrical connection therebetween by associated die-to-die bond wires,
• at least one of said die-to-die bond wires providing a signal from the first die for collapsing power to select circuits on the second die during standby mode while maintaining power to other circuits on the same die.

An IC package including an encapsulated integrated circuit, the IC having a first die in stacked configuration relative to a second die with the first and second dies comprised of dominantly digital circuits and analog circuits, respectively,

• the first and second dies having bonding pads providing electrical connection therebetween by associated die-to-die bond wires,
• at least one of said die-to-die bond wires providing a signal from the first die for collapsing power to select circuits of the second die during standby mode while maintaining power to other circuits on the same die.