Semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorHajime Iizuka
Life of this patent
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Abstract
A semiconductor device in which a plurality of semiconductor chips are consolidated into one and which is provided with at least a set of rerouting wiring lines formed so as to interconnect electrodes of the respective semiconductor chips, the electrodes having a function which is common to the respective semiconductor chips, the set of rerouting wiring line having a common external connection terminal.
Claims19
A semiconductor device comprising a plurality of semiconductor chips consolidated into one, each semiconductor chip having formed on its surface electrodes, a first insulation film formed so as to expose the electrodes, patterned rerouting wiring lines formed on the first insulation film to be connected to the electrodes, and a second insulation film formed to cover the first insulation film and the rerouting wiring lines in such a manner that a portion of the rerouting wiring line is exposed for connection with an external connection terminal, wherein the semiconductor device comprises at least a set of rerouting wiring lines formed so as to interconnect electrodes of the respective semiconductor chips, the electrodes having a function which is common to the respective semiconductor chips, the set of rerouting wiring line having a common external connection terminal.
The semiconductor device comprising a plurality of semiconductor chips consolidated into one, each semiconductor chip having formed on its surface electrodes, an insulation film formed so as to expose the electrodes, patterned rerouting wiring lines formed on the first insulation film to be connected to the electrodes, metal posts formed to be connected to the rerouting wiring line for subsequent connection with an external connection terminal, and an encapsulation layer formed of a resin to encapsulate the insulation film, the patterned rerouting wiring lines, and the metal posts in such a manner that ends of the metal posts to be connected with the external connection terminals are exposed, wherein the semiconductor device comprises at least a set of rerouting wiring lines formed so as to interconnect electrodes of the respective semiconductor chips, the electrodes having a function which is common to the respective semiconductor chips, the set of rerouting wiring line having a common external connection terminal.
A semiconductor device comprising a plurality of semiconductor chips consolidated into one, each semiconductor chip having formed on its surface electrodes, a first insulation film formed so as to expose the electrodes, patterned rerouting wiring lines formed on the first insulation film to be connected to the electrodes, external connection terminals formed by connecting a wire to the rerouting wiring line in such a manner that the wire stands up from the face of the rerouting wiring line, and a second insulation film formed to cover the first insulation film, the rerouting wiring lines, and the wires in such a manner that free ends of the wires of external connection terminals are exposed, wherein the semiconductor device comprises at least a set of rerouting wiring lines formed so as to interconnected electrodes of the respective semiconductor chips, the electrodes having a function which is common to the respective semiconductor chips, the set of rerouting wiring line having a common external connection terminal.
Dependencies are inferred from the claim text.