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US 6,472,742 B1Granted
Thermal gap control
AssigneeIntel Corporation
InventorsRakesh Bhatia, Gregory A. James
Life of this patent
Estimating the term…
Abstract
A heat dissipating element (e.g., a heat sink) is held in an initial position closer to a heat generating structure (e.g., a microprocessor) and in a subsequent position farther from the microprocessor. A thermal interface material (e.g., a thermal grease) spans the gap, but is not held under compression, between the heat sink and the microprocessor.
Claims11
Apparatus comprising
- a support,
- a heat dissipating element attached to the support,
- a heat generating element attached to the support and defining a gap between the heat dissipating element and the heat generating element, and
- a viscous material spanning the gap,
- the support being configured to permit adjustment of a size of the gap over a range from smaller sizes up to a predefined size, the support including a resilient element that biases the support to a position in which the gap has the predefined size and the viscous material spans the gap.
2 more elements
Dependencies are inferred from the claim text.