Self-supporting air bridge interconnect structure for integrated circuits
AssigneeInternational Business Machines Corporation
InventorsBrett H. Engel, Timothy J. Dalton
Life of this patent
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Abstract
A method for forming a multilevel interconnect structure for an integrated circuit is disclosed. In an exemplary embodiment of the invention, the method includes forming a starting structure upon a substrate, the starting structure having a number of metallic conducting lines contained therein. A disk is bonded to the top of said starting structure, the disk including a plurality of mesh openings contained therein. The mesh openings are then filled with an insulative material, thereby forming a cap upon the startig structure, wherein the cap may structurally support additional interconnect layers subsequently formed thereatop.
Claims30
A multilevel interconnect structure for an integrated circuit, comprising:
- a starting structure formed upon a substrate, said starting structure having a number of metallic conducting lines contained therein;
- a disk having a plurality of mesh openings contained therein, said disk being bonded to the top of said starting structure;
- and
- said mesh openings filled with an insulative material, thereby forming a cap upon said starting structure;
- wherein said cap may structurally support additional interconnect layers subsequently formed thereatop.
A multilevel interconnect structure for an integrated circuit, comprising:
- a starting structure formed upon a substrate, said starting structure having a number of metallic conducting lines contained therein;
- the top of said starting structure immersed in a liquid bath, said liquid bath being cured into a solid surface, thereby forming a cap upon said starting structure;
- wherein said cap may structurally support additional interconnect layers subsequently formed thereatop.
Dependencies are inferred from the claim text.