Electronic circuit support comprising tear resistant means
AssigneeBull CP8
InventorAlain Le Loc'h
Life of this patent
Estimating the term…
Abstract
The invention relates to a substrate for an electronic circuit (9), the electronic circuit carrying at least one contact pad, the substrate comprising an insulating element (3, 12) housing the electronic circuit and carrying, on an external side, a conductive layer defining at least one contact region (7, 8), said contact pad being connected to said contact region. The substrate comprises at least one fragile zone (5, 6) disposed in the insulating element (3, 12). The electronic circuit substrate may be constituted by a chip card wherein an external readable button contains the electronic circuit. The chip card may cooperate electrically with a card reader.
Claims32
A substrate for an electronic circuit, the substrate comprising:
- an insulating element housing the electronic circuit and having a conductive layer on an external side, the conductive layer defining at least one contact region, the electronic circuit having at least one contact pad, said contact pad being connected to said contact region, and at least one fragile zone disposed in said insulating element, wherein the at least one fragile zone is designed so as to cause said insulating element to break along said fragile zone when a mechanical stress of a predetermined level is applied to said insulating element.
A substrate for an electronic circuit, the substrate comprising:
- an insulating element housing the electronic circuit and having a conducting layer on an external side, the conducting layer defining at least one contact region, the electronic circuit having at least one contact pad, said contact pad being connected to said contact region, and at least one fragile zone disposed in said insulating element,
- wherein the insulating element comprises an insulating layer to which the electronic circuit is bonded, and a casing covering the electronic circuit, said fragile zone being disposed inside the casing.
An electronic device, comprising:
- an insulating layer;
- and
- an electronic circuit disposed on said insulating layer, said insulating layer including at least one hole which extends through said insulating layer at a location which, when a mechanical stress is applied to said insulating layer, causes said insulating layer to break along said hole.
An electronic device, comprising:
- an insulating layer;
- an electronic circuit disposed on said insulating layer;
- and
- a casing enclosing said electronic circuit, said casing including a fragile zone which causes at least said casing to break when a mechanical stress is applied to said insulating layer.
A smart card, comprising:
- a card substrate;
- and
- an electronic device on said card substrate, said electronic device including:
- (a) an insulating layer;
- and
- (b) an electronic circuit disposed on said insulating layer, said insulating layer including at least one hole which extends through said insulating layer at a location which, when a mechanical stress is applied to said substrate, causes said insulating layer to break along said hole.
Dependencies are inferred from the claim text.