BGA package and method for fabricating the same
AssigneeOki Electric Industry Co., Ltd.
InventorMakoto Terui
Life of this patent
Estimating the term…
Abstract
A ball grid array (BGA) package includes a substrate (20) having first and second surfaces. and through holes (30) passing through it. The package further includes a first semiconductor chip (28) which is mounted on the first surface of the substrate (20); a second semiconductor chip (36) which is mounted on the second surface of the substrate (20); and solder balls (34) which are provided on the first surface of the substrate (20) and are electrically connected to the first semiconductor chip (28). The second semiconductor chip (36) is electrically connected via the through holes (30) to the solder balls (34).
Claims17
A method for fabricating a ball grid array (BGA) package, comprising the steps of:
- providing a substrate base, which has first and second surfaces thereof:
- forming first and second insulating layers on the first and second surfaces of the substrate base, respectively;
- forming through holes in the substrate base;
- forming first and second conductive patterns on the first and second insulating layers. respectively, wherein the substrate base, first and second insulating layers and first and second conductive patterns form a substrate;
- forming a hole in the substrate so that the hole passes through the substrate;
- mounting a second semiconductor chip on the second surface of the substrate over the hole;
- injecting a resin into a space between the second semiconductor chip and substrate through the hole;
- hardening the resin with heat to seal the second semiconductor chip therein;
- mounting a first semiconductor chip on the first surface of the substrate;
- providing solder balls on the first surface of the substrate so that the first semiconductor chip is electrically connected through the first conductive pattern to the solder balls and the second semiconductor chip is electrically connected through the second conductive pattern and through holes to the solder balls.
A semiconductor device, comprising:
- a pressed metal substrate having a first surface and a second surface opposing the first surface, wherein a cavity is formed in the first surface and a projecting portion corresponding to the cavity is formed on the second surface;
- first and second insulating layers formed on the first surface and second surface, respectively;
- first conductive patterns and second conductive patterns formed on the first and second insulating layers, respectively;
- a first semiconductor chip mounted in the cavity and being electrically connected to the first conductive patterns;
- a second semiconductor chip mounted on the projecting portion and being electrically connected to the second conductive patterns;
- and
- a plurality of solder balls which are electrically connected to the first and second conductive patterns.
A method of making a semiconductor device, comprising:
- providing a pressed metal substrate having a first surface and a second surface opposing the first surface;
- forming a cavity in the first surface and forming a projecting portion corresponding to the cavity on the second surface;
- forming first and second insulating layers on the first surface and the second surface, respectively;
- forming first conductive patterns and second conductive patterns on the first and second insulating layers, respectively;
- mounting a first semiconductor chip in the cavity, the first semiconductor chip being electrically connected to the first conductive patterns;
- mounting a second semiconductor chip on the projecting portion, the second semiconductor chip being electrically connected to the second conductive patterns;
- and
- electrically connecting a plurality of solder balls to the first and second conductive patterns.
Dependencies are inferred from the claim text.