Semiconductor device and method of manufacturing the same

A semiconductor device, comprising:

• a semiconductor element including an integrated circuit and transistors, at least a part of the semiconductor where the transistors are provided are provided in a high density element being thinned so as to be warped;
• a distortion die-pad having a,securing surface having a shape capable of holding the thinned part of the semiconductor element in a predetermined warped state;
• a package for sealing inside the distortion die-pad having the securing surface on which the semiconductor element is secured;
• and
• lead wires each having an end connected to the semiconductor element and the other end sticking out of the package,
• the semiconductor element operates normally as long as the thinned part is held in the warped state, and is prevented from operating normally if the thinned part changes into a flat state, and
• once the semiconductor element is separated from the distortion die-pad, the thinned part is released from the warped state and changes into a flat state because of elasticity of the semiconductor element;
• wherein
• the semiconductor element further includes detection means for detecting a change in an electrical current of the, transistors that occurs when the thinned part is warped and thereby controlling operation of the integrated circuit, and
• the detection means prevents the semiconductor element from operating normally either by terminating transmission of a signal causing the integrated circuit to operate normally or by transmitting a signal preventing operation of the integrated circuit.