Semiconductor device

A semiconductor device, comprising:

• a semiconductor device chip which has front and rear surfaces and at least two straight grooves engraved on the rear surface thereof, each groove extending from corners of the semiconductor device chip toward a central region of the semiconductor device chip;
• a plurality of connection bars which support regions on the rear surface adjacent to the corners of the semiconductor device chip and which are placed in the respective straight grooves, wherein the connection bars include a first bar and a second bar, the first bar being opposite to the second bar, and the first bar being so short as to not reach the second bar but long enough to support a corner of the semiconductor device chip, and wherein a terminal end of the first bar is straight, and a terminal end of the second bar is straight, the respective terminal ends being disposed in respective ones of the grooves;
• a plurality of bonding pads arranged along sides of the front surface of the semiconductor device chip;
• a plurality of continuous bars comprised of an inner lead and an outer lead, each of the plurality of continuous bars being electrically connected with a respective bonding pad;
• and
• a mold resin confining the semiconductor device chip, the connection bars and the inner lead;
• wherein said semiconductor device chip has a thickness that is substantially greater than about 300 μm.

A semiconductor device, comprising:

• a semiconductor device chip having a thickness substantially greater than about 300 μm;
• a die pad which supports the semiconductor device chip;
• a connection bar which is connected with the die pad and which supports an edge of the semiconductor device chip;
• a groove engraved on a rear surface of the semiconductor device chip, and extending from the edge of the chip toward a central region of the semiconductor device chip;
• a centrally disposed recess that is in communication with the groove, the recess accommodating the die pad therein, wherein the groove accommodates the connection bar therein;
• and
• a mold resin confining the semiconductor device chip, the die pad and the connection bar, wherein a total thickness of said semiconductor device is no greater than about 1 mm;
• wherein said mold resin has about a same thickness both over and under the semiconductor device chip;
• and
• wherein the groove has a depth that is less than ½ of the thickness of said semiconductor device chip.

A semiconductor device, comprising:

• a semiconductor device chip which has front and rear surfaces and a groove engraved on the rear surface thereof, the groove extending from comers of the semiconductor device chip toward a central region of the semiconductor device chip, wherein said semiconductor device chip has a thickness substantially greater than about 300 μm between the front and rear surfaces;
• a die pad which has a size smaller in area than that of the semiconductor device chip and which supports the semiconductor device chip at the central region thereof, and which is placed in the groove;
• connection bars which are connected with the die pad and which support regions on the rear surface adjacent to the corners of the semiconductor device chip, and which are placed in the groove;
• a plurality of bonding pads arranged along sides of the front surface of the semiconductor device chip;
• a plurality of continuous bars comprised of an inner lead and an outer lead, each of the plurality of continuous bars being electrically connected with a respective bonding pad;
• and
• a mold resin confining the semiconductor device chip, the die pad, the connection bars and the inner lead,
• wherein a total thickness of said semiconductor device is no greater than about 1 mm;
• and
• wherein said mold resin has about a same thickness both over and under the semiconductor device chip.