Condition sensitive adhesive tape for singulated die transport devices

A method of receiving, holding, and releasing die devices in a die transport system, said method comprising the steps of:

• providing a die transport system having a carrier plate with a top surface and a bottom surface and at least one hole extending between said top surface and said bottom surface, said carrier plate having a sheet of adhesive tape affixed to said bottom surface to cover said at least one hole;
• placing a die device in each of said at least one hole, one side of said die device affixing to said sheet of adhesive tape;
• subjecting said sheet of adhesive tape to an elevated temperature sufficient to reduce the adhesiveness of said sheet of adhesive tape sufficient to allow removal of said die device from said carrier plate;
• and
• removing said die device from said die transport system;
• wherein the reduction of the adhesiveness of said sheet of adhesive tape is sufficient by itself to allow removal of said die devices from said carrier plate.