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US 6,472,726 B1Granted
Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
Estimating the term…
Abstract
A semiconductor device and method for fabricating a semiconductor device. Semiconductor chips are affixed by an adhesive to a tape carrier on which bonding portions are formed in a matrix. Electrodes formed on the semiconductor chips are electrically connected to the bonding portions. The tape carrier is then divided into individual units for each of the semiconductor chips.
Claims42
A method of fabricating a semiconductor device, comprising the steps of:
- affixing semiconductor chips by an adhesive to a tape carrier on which are formed bonding portions in a matrix, said tape carrier having a surrounding portion around each of said bonding portions;
- connecting electrodes formed on said semiconductor chips electrically to said bonding portions;
- and
- dividing said tape carrier into individual units for each of said semiconductor chips leaving at least a part of said surrounding portion.
1 more element
A semiconductor module comprising:
- a rectangular substrate on which electrically conductive bonding portions are formed in a matrix, said rectangular substrate having a spacing portion between adjacent two of said bonding portions;
- a plurality of semiconductor chips to be disposed at positions corresponding to said bonding portions;
- and
- an adhesive for connecting said rectangular substrate and said semiconductor chips, said adhesive provided continuously over said adjacent two of said bonding portions and said spacing portion.
1 more element
A method of fabricating a semiconductor device, comprising the steps of:
- affixing semiconductor chips by an adhesive to a tape carrier on which are formed bonding portions in a matrix;
- connecting electrodes formed on said semiconductor chips electrically to said bonding portions;
- holding by a fixing tool a portion of said tape carrier between adjacent two of said semiconductor chips;
- and
- dividing said tape carrier into individual units for each of said semiconductor chips.
2 more elements
A semiconductor module comprising:
- a rectangular substrate on which bonding portions are formed in a matrix, said rectangular substrate having marks for separating said bonding portions from said rectangular substrate;
- and
- a plurality of semiconductor chips to be disposed at positions corresponding to said bonding portions.
Dependencies are inferred from the claim text.